Epoxy Curing System with Liquid 1,3-Bis(3-aminopropyl) tetramethyl Disiloxane as Curing Agent for Advanced Electronic Package

摘要:

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, 1,3-bis(3-aminopropyl) tetramethyl disiloxane (DS) is used as liquid epoxy curing agent of epoxy molding compounds(EMCs) for high-reliability semiconductor devices. Experimental results indicated that DS could be effectively used as epoxy curing agent and greatly lower the viscosity of epoxy system, in which way, the coefficient of thermal expasion(CTE) of EMCs can be lowered effectively by increasing the filler loading. The concentration of DS strongly affected the mechanical properties of the thermally cured epoxy composites. As expected, the flexural modulus of epoxy composite decreased and the toughness was improved.

信息:

期刊:

编辑:

Yansheng Yin and Xin Wang

页数:

2135-2138

DOI:

10.4028/www.scientific.net/AMR.79-82.2135

引用:

H. Y. Li and C. H. Xie, "Epoxy Curing System with Liquid 1,3-Bis(3-aminopropyl) tetramethyl Disiloxane as Curing Agent for Advanced Electronic Package", Advanced Materials Research, Vols. 79-82, pp. 2135-2138, 2009

上线时间:

August 2009

输出:

价格:

$35.00

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