A new Insight into the Electromigration Behavior of Copper Interconnects: The Roles of Grain Boundary and Surface Diffusion

摘要:

文章预览

信息:

期刊:

编辑:

H. Mehrer, Chr. Herzig, N.A. Stolwijk, H. Bracht

页数:

1673-1678

引用:

E. E. Glickman and M. Nathan, "A new Insight into the Electromigration Behavior of Copper Interconnects: The Roles of Grain Boundary and Surface Diffusion", Defect and Diffusion Forum, Vols. 143-147, pp. 1673-1678, 1997

上线时间:

January 1997

输出:

价格:

$38.00