Grain Boundary and Bulk Diffusion in Au-Cu Thin Films

摘要:

文章预览

信息:

期刊:

编辑:

M. Koiwa, K. Hirano, H. Nakajima and T. Okada

页数:

457-462

引用:

A.N. Aleshin et al., "Grain Boundary and Bulk Diffusion in Au-Cu Thin Films", Defect and Diffusion Forum, Vols. 95-98, pp. 457-462, 1993

上线时间:

January 1993

输出:

价格:

$38.00