Characterization of Cold Drawn Gold bonding Wire with EBSD

摘要:

文章预览

信息:

期刊:

编辑:

Dong Nyung Lee

页数:

499-504

引用:

J. H. Cho et al., "Characterization of Cold Drawn Gold bonding Wire with EBSD", Materials Science Forum, Vols. 408-412, pp. 499-504, 2002

上线时间:

August 2002

输出:

价格:

$38.00