Thermal Characterisation of AlGaN/GaN HEMTs using Micro-Raman Scattering Spectroscopy and Pulsed I-V Measurements

摘要: GaN films are grown on Si(111) with low-temperature GaN (LT-GaN) layers as buffer layers by hydride vapor phase epitaxy (HVPE). The LT-GaN layers are deposited at different temperatures ranging from 400 to 900 °C. The surface property, the structure and optical properties of the GaN films with different LT-GaN layers are studied. When deposition temperature of LT-GaN layer is 600 °C, the GaN film shows the best properties.

摘要: Confocal μ-Raman was used to measure the operating temperatures in SiC MESFETS, AlGaN/GaN/SiC HEMT’s and 4H-SiC PiN diodes. Temperatures obtained from thermal imaging of the MESFETS compared well with those measured from Raman scattering. Operating temperatures were also obtained for large area PiN diode and it was shown that a single point at the center of the device can be used to measure the average temperature.

摘要: Cubic SiC/Si (111) template is an interesting alternative for growing GaN on silicon. As compared with silicon, this substrate allows reducing the stress in GaN films due to both lower lattice and thermal expansion coefficient mismatch, and can provide better heat dissipation. In this work, we first developed the epitaxial growth of 3C-SiC films on 50mm Si(111) substrates using chemical vapor deposition. AlGaN/GaN high electron mobility transistors were grown by molecular beam epitaxy on these films. Both the structural quality and the electrical behavior of these structures show the feasibility of this approach.

摘要: Al0.35Ga0.65N/GaN- and Al0.2Ga0.8N/AlN/GaN-heterostructures high electron mobility transistors (HEMTs) with a gate length (LG) varying from 1.2 to 0.08 µm were fabricated on silicon Si(111) substrates using a 3C-SiC transition layer. Metal organic chemical vapour deposition (MOCVD) was used to growth the AlGaN-heterostructures and a low pressure chemical vapour deposition (LPCVD) to create the 3C-SiC(111) transition layer preventing Ga-induced melt back etching and Si-out diffusion. Reduced Al content and an AlN interlayer improved the device performance. The HEMTs with LG=0.08µm had a maximum drain current density of 1.25 A/mm and a peak extrinsic transconductance of 400 mS/mm. A unity current gain cut-off frequency (ƒT) of 180 GHz and maximum frequency (ƒmax) of 70 GHz were measured on these devices.