通过作者查论文: Sachiko Ito

文章题目页数

作者: Kazutoshi Kojima, Sachiko Ito, Junji Senzaki, Hajime Okumura
摘要: We have carried out detailed investigations of 4H-SiC homoepitaxial growth on vicinal off-angled Si-face substrates. We found that the surface morphology of the substrate just after in-situ H2 etching was also affected by the value of the vicinal-off angle. Growth conditions consisting of a low C/Si ratio and a low growth temperature were effective in suppressing macro step bunching at the grown epilayer surface. We also demonstrated epitaxial growth without step bunching on a 2-inch 4H-SiC Si-face substrate with a vicinal off angle of 0.79o. Ni Schottky barrier diodes fabricated on an as-grown epilayer had a blocking voltage above 1000V and a leakage current of less than 5x10-7A/cm2. We also investigated the propagation of basal plane dislocation from the vicinal off angled substrate into the epitaxial layer.
99
作者: Keiko Masumoto, Sachiko Ito, Hideto Goto, Hirotaka Yamaguchi, Kentaro Tamura, Chiaki Kudou, Johji Nishio, Kazutoshi Kojima, Toshiyuki Ohno, Hajime Okumura
摘要: We have investigated a conversion of basal plane dislocation (BPD) to threading edge dislocation (TED) in growth of epitaxial layers (epi-layers) on 4H-SiC vicinal substrates with an off-angle of 0.85° at low C/Si ratio of 0.7 by using deep KOH etching and X-ray topography observations. Deep KOH etching indicated that BPDs in the substrates converted to TEDs in the epi-layers. X-ray topography observations suggested that the conversion occurred during epitaxial growth when the thickness of epi-layers was less than 1.5 μm. We found that the conversion ratio obtained from counting deep KOH etch pits was over 99%.
99
作者: Kazutoshi Kojima, Keiko Masumoto, Sachiko Ito, Akiyo Nagata, Hajime Okumura
摘要: We have investigated key factors for controlling the polytype and surface morphology of 4H-SiC homoepitaxial growth on less than 4o off-axis substrates. In addition, we characterized the crystal quality and surface quality of the epitaxial layer of an entire 3-inch vicinal off angled substrate. The results suggested that the control of surface free energy, control of the vicinal off angle itself, and high temperature growth, is highly important in controlling the surface morphology and polytype stability of the epitaxial layer grown on a vicinal off angled substrate. We also obtained a high-quality epitaxial layer grown on a 3-inch vicinal off angle substrate, which was comparable to those on 4o off-axis substrates.
125
作者: Shinsuke Harada, Makoto Kato, Sachiko Ito, Kenji Suzuki, Takasumi Ohyanagi, Junji Senzaki, Kenji Fukuda, Hajime Okumura, Kazuo Arai
摘要: Reliability of the gate oxide is influenced by the device structure and the processes. In the SiC MOSFET, the surface morphology is degraded by the high temperature activation RTA, and the degradation is remarkable on the n+ source region. This study develops the method to suppress the degradation of the reliability of the gate oxide on the carbon face. By utilizing the carbon cap for the RTA and the high density O2 plasma etching to remove the carbon cap, the reliability is drastically improved both on the un-implanted and the implanted surfaces. Especially, the degradation of the reliability is perfectly suppressed on the un-implanted surface.
549
作者: Shinsuke Harada, Sachiko Ito, Makoto Kato, Akio Takatsuka, Kazutoshi Kojima, Kenji Fukuda, Hajime Okumura
摘要: UMOSFET is theoretically suitable to decrease the on-resistance of the MOSFET. In this study, in order to determine the cell structure of the SiC UMOSFET with extremely low on-resistance, influences of the orientation of the trench and the off-angle of the wafer on the MOS properties are investigated. The channel resistance, gate I-V curves and instability of threshold voltage are superior on the {11-20} planes as compared with other planes. On the vicinal off wafer, influence of the off-angle disappears and the properties on the equivalent planes are almost the same. The obtained results indicate that the extremely low on-resistance with the high stability and high reliability is possible in the SiC UMOSFET by the hexagonal cell composed of the six {11-20} planes on the vicinal off wafer, and actually an extremely low channel resistance was demonstrated on the hexagonal UMOSFET with the six {11-20} planes on the vicinal off wafer.
999
作者: Kazutoshi Kojima, Tomohisa Kato, Sachiko Ito, Jun Kojima, Fusao Hirose, Yasuo Kito, Shoichi Yamauchi, Koichi Nishikawa, Ayumu Adachi
摘要: We investigated a way of reducing the stacking fault (SF) density on a highly nitrogen (N) doped 4H-SiC crystal. SFs were generated at highly N doped crystal exceeding 4 x 1019 cm-3 and the density was increased with increasing N concentration. We found that Al co-doping had the potential to suppress this SF generation and was effective up to an N concentration of about 1 x 1021cm-3. This effect depended strongly on the Al concentration. We discussed the reason for the SF suppression effect of Al co-doping.
8
作者: Kentaro Tamura, Masayuki Sasaki, Chiaki Kudou, Tamotsu Yamashita, Hideki Sako, Hirokuni Asamizu, Sachiko Ito, Kazutoshi Kojima, Makoto Kitabatake
摘要: On 4H-SiC Si-face substrates after H2 etching, the defect with “line” feature parallel to a step as “bunched-step line” was observed. Using X-ray topography and KOH etching, we confirmed that the bunched-step line originated from basal plane dislocation (BPD). Use of the substrate with the lowest BPD density will be effective to reduce bunched-step line that would affect oxide layer reliability on an epitaxial layer. However, more detail investigation needs to classify the BPD that would become a starting point of bunched-step line.
367
作者: Johji Nishio, Hirokuni Asamizu, Chiaki Kudou, Sachiko Ito, Keiko Masumoto, Kentaro Tamura, Kazutoshi Kojima, Toshiyuki Ohno
摘要: The guidelines necessary to improve the n-type doping uniformity on C-face epitaxial growth of 4H-SiC have been examined as far as the practical throughput is maintained, e.g. 3×150 mm wafers with the growth rate higher than 20 μm/h. The flow-channel enlargement was carried out and the effect was estimated by temperature distribution estimation performed by hydrogen etching. Also, effective C/Si was simulated with the temperature distribution obtained from the hydrogen etching experiments. As a result, positional agreement was found between the region where carrier concentration begins to increase and the drastic drop in temperature and the effective C/Si ratio.
169
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