通过关键词查论文: BGA

文章题目页数

作者: Shin Chieh Lin, Hsin I Lu
摘要: It is of interest to study the feasibility of using computing tomography technique on BGA inspection. The effects of system parameters on the quality of the reconstructed images were studied first. The system parameters studied are projection type, projection number, sensor number, and filter. For fan beam projection, there are two additional parameters are studied. They are the fan beam arc angle and the sensor geometry. It was found that the increase in projection number and sensor number generally improve the quality of reconstructed image. The effects of sensor geometry and the fan beam arc angle are not significant. BGA simulation test show the feasibility of using this technique to detect the shape and location of defects inside the BGA.
331
作者: Jong Woong Kim, Sun Kyu Park, Seung Boo Jung
摘要: Ball shear test was investigated in terms of effects of important test parameters, i.e. shear height and shear speed, with an experimental and non-linear finite element analysis for evaluating the solder joint integrity of area array packages. A Pb-free solder composition was examined in this work: Sn-3Ag-6Bi-2In. The substrate was a common SMD (Solder Mask Defined) type with solder bond pad openings of 460㎛ in diameter. It could be observed that increasing shear height, at fixed shear speed, has the effect of decreasing shear force, while the shear force increased with increasing shear speed at fixed shear height. Too high shear height could cause some bad effects on the test results such as unexpected high standard deviation values or shear tip sliding from the solder ball surface. The low shear height conditions were favorable for screening the type of brittle interfacial failures or the degraded layers in the interfaces.
851
作者: Jong Woong Kim, Seung Boo Jung
摘要: The effects of void formation on the joint strength and failure mode of the solder joints were examined. A computational modeling technique, i.e., finite element modeling, was employed to investigate the effects. The effects of location, size and number of void were also investigated and compared with the case that has no void in the solder ball. When there was 1 or more voids in the solder ball, the joint strength decreased regardless of the location, size, and number of voids. Especially, the shear force of the joints decreased about 50% when 3 voids were formed in the solder ball. From the stress analyses, the possibility of preliminary brittle interfacial failure should be lower when voids were formed in the solder ball.
546
作者: Feng Jiang Wang, Xin Ma, Yiyu Qian
摘要: Berkovich micro-indentation tests with different loading rates have been performed on the ball grid array solder joint with a Pb-free solder, Sn-4.0Ag-0.5Cu alloy. The resulting indentation load-depth curves are rate dependent and have varying creep penetration depths during the same hold time. Creep indentation hardness and rate sensitivity have been defined from the concept of “work of indentation”. The rate sensitivity of BGA solder joint is 0.0574.
399
作者: Jong Woong Kim, Jeong Won Yoon, Seung Boo Jung
摘要: The experimental investigation and non-linear finite element analysis using elastic-viscoplastic constitutive model were conducted to study the effect of ball shear speed on shear force of BGA solder joints. The Ag3Sn intermetallic compound (IMC) particles were found inside the Sn-3.5Ag solder, while the fine intermixed structure of lead-rich phases and tin-rich phases was investigated inside the eutectic Sn-37Pb solder. The shear force linearly increased with shear speed and reached to the maximum value at the highest shear speed in both experimental and computational results. All of the test specimens were fractured like ductile mode, and the plastic strain energy density distributions were deeply related to the failure mechanism.
897
作者: Fang Liu, Guang Meng
摘要: Finite element (FE) method is an efficient and power tool, and is adopted to analyze dynamic response of printed circuit board (PCB) assembly. First, FE model of PCB assembly was established. Second, the dynamic behaviors of ball gird array (BGA) lead-free solder joint were obtained when the PCB assembly was subjected to a half-sine acceleration pulse. Results show that the maximum tensile stresses occur at solder joints located at the four outermost corners of BGA and solder joints at outermost corners are the most vulnerable to crack. In addition, it can be found during FE analysis that the solder joint reliability can be enhanced as the PCB damping increases and input acceleration level reduces.
451
作者: Masaki Misawa, Ion Tiseanu, Ryusuke Hirashima, Kazuto Koizumi, Yasushi Ikeda
1135
作者: Jong Woong Kim, Sun Kyu Park, Seung Boo Jung
摘要: Ball shear test was investigated in terms of the effects of important test parameter, i.e., shear height, with an experimental and non-linear finite element analysis for evaluating the solder joint integrity of area array packages. The substrate was a common SMD type with solder bond pad openings of 460 ㎛ in diameter. It was observed that increasing the shear height, at a fixed shear speed, has the effect of decreasing the shear force. The high shear height could cause some bad effects on the test results such as unexpected high standard deviation values or shear tip sliding from the solder ball surface. The low shear height conditions were favorable for screening the type of brittle interfacial fractures or the degraded layers in the interfaces.
269
作者: Z. Sauli, V. Retnasamy, S. Taniselass, N.A.Z. Rahman, M.H.A. Aziz
摘要: Ball grid array is an interconnection method widely used in the electronic packaging industry. The reliability of the solder ball is being improved by introducing new materials for the solder ball. In this study, the stress response of BGA solder ball during minimum vertical loading is analyzed through simulation. The stress response between two types of solder ball, Normal BGA and Micropearl BGA are compared. The Micropearl BGA is a solder ball which contains polymer core. The vertical loading forces used were 1N and 3N. A commercial computational software ANSYS was used for the simulation. The simulation results showed that the Normal BGA exhibited higher stress response.
639
作者: Yan Hong Tian, Chun Qing Wang
摘要: Reliability optimization design of Ball Grid Array (BGA) solder joints is a major concern in area array electronics packaging technology. In this paper, shapes of the solder joints and their reliability were predicted and analyzed. Through the variations of lower pads’ diameters, the shapes of full array BGA solder joints with different solder volumes were predicted by using surface evolver software. Based on the results of shape prediction, 3-D finite element models were established with MSC.MARC and the distribution of the stress and strain in the BGA solder joints under thermal cyclic loading were simulated. Finally, fatigue lives of the BGA solder joints with different solder volumes were calculated, and the diameter ratios of lower pad to upper pad for these two kinds of BGA assemblies with the best reliability were optimized.
2944
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