通过关键词查论文: Carbon Face

文章题目页数

作者: Hiroshi Kono, Takuma Suzuki, Makoto Mizukami, Chiharu Ota, Shinsuke Harada, Junji Senzaki, Kenji Fukuda, Takashi Shinohe
摘要: Silicon carbide Double-Implanted Metal-Oxide-Semiconductor Field-Effect Transistors (DIMOSFETs) were fabricated on 4H-SiC (000-1) carbon face. The DIMOSFETs were characterized from room temperature to 250°C. At room temperature, they showed a specific on-resistance of 4.9 mΩcm2 at a gate bias of 20 V and a drain voltage of 1.0 V. The specific on-resistance taken at a drain current (Id) of 260 A/cm2 was 5.0 mΩcm2. The blocking voltage of this device was higher than 1360 V at room temperature. At 250°C, the specific on-resistance increased from 5.0 mΩcm2 to 12.5 mΩcm2 and the threshold voltage determined at Id = 26 mA/cm2 decreased from 5.5 V to 4.3 V.
987
作者: Kazutoshi Kojima, Hajime Okumura, Satoshi Kuroda, Kazuo Arai, Akihiko Ohi, Hiroyuki Akinaga
摘要: Homoepitaxial growth was carried out on 4H-SiC on-axis substrate by horizontal hot wall chemical vapor deposition. By using carbon face substrate, specular surface morphology of a wide area of up to 80% of a 2-inch epitaxial wafer was obtained at a low C/Si ratio growth condition of 0.6. The Micropipe in on-axis substrate was indicated to be filled with spiral growth and to be dissociated into screw dislocations during epitaxial growth. It was found that the appearance of basal plane dislocations on the epitaxial layer surface can be prevented by using an on-axis substrate.
93
作者: Takashi Aigo, M. Sawamura, Tatsuo Fujimoto, Masakazu Katsuno, Hirokatsu Yashiro, Hiroshi Tsuge, Masashi Nakabayashi, Taizo Hoshino, Noboru Ohtani
摘要: 4H-SiC epitaxial layers on Carbon-face (C-face) substrates were grown by a low-pressure hot-wall type chemical vapor deposition system. The C-face substrates were prepared by fine mechanical polishing using diamond abrasives with the grit size of 0.25 %m and in-situ HCl etching at 1400°C, which produced surface roughness of 0.27 nm. The use of the smooth substrates made it possible to decrease the substrate temperature and specular surface morphologies were realized at C/Si ratios of 1.5 or less both for a substrate temperature of 1550°C and for that of 1500°C. Surface roughness of 0.26 nm and the residual donor concentration of 6.7×1014 cm-3 were obtained for a C-face epitaxial layer grown at a C/Si ratio of 1.5 and at a substrate temperature of 1550°C. Schottky barrier diodes were fabricated on a non-doped C-face epitaxial layer grown at 1500°C and it was verified that a high quality metal-semiconductor interface was formed on the epitaxial layer.
153
作者: Kenji Fukuda, Makoto Kato, Junji Senzaki, Kazutoshi Kojima, Takaya Suzuki
1417
作者: Kung Yen Lee, Shin Yi Lee, Chih Fang Huang
摘要: This research is focused on the influence of high C/Si ratios and low pressure on n-type doping concentration and surface defects of 4H-SiC C-face epilayers. N-type doping concentration decreases as C/Si ratio increases from 3.0 to 4.0 and pressure reduces from 100 mbar to 50 mbar; defect densities decrease as pressure increases at both C/Si ratios of 3.0 and 4.0. RMS roughness is about 0.21 nm for all C-face samples, independent of C/Si ratios of 3.0 and 4.0 and pressure from 50 mbar to 100 mbar. However, the influence of growth temperature on doping concentration and surface defects can not be clearly observed in this work.
123
作者: Jody Fronheiser, Aveek Chatterjee, Ulrike Grossner, Kevin Matocha, Vinayak Tilak, Liang Chun Yu
摘要: The gate oxide reliability and channel mobility of carbon face (000-1) 4H Silicon Carbide (SiC) MOSFETs are investigated. Several gate oxidation processes including dry oxygen, pyrogenic steam, and nitrided oxides were investigated utilizing MOS capacitors for time dependent dielectric breakdown (TDDB), dielectric field strength, and MOSFETs for inversion layer mobility measurements. The results show the C-face can achieve reliability similar to the Si-face, however this is highly dependent on the gate oxide process. The reliability is inversely related to the field effect mobility where other research groups report that pyrogenic steam yields the highest electron mobility while this work shows it has weakest oxide in terms of dielectric strength and shortest time to failure.
354
作者: Akimasa Kinoshita, Takasumi Ohyanagi, Tsutomu Yatsuo, Kenji Fukuda, Hajime Okumura, Kazuo Arai
摘要: It is known that a Schottky barrier height (b) of metal/C-face 4H-SiC Schottky barrier diode (SBD) differ from b of metal/Si-face 4H-SiC SBD. Furthermore, b of metal/4H-SiC SBD varies with annealing temperature. We fabricate 0.231mm2 SBD with Ti/SiC interface using Si-face and C-face 4H-SiC. These SBDs are annealed at several temperatures after a formation of the Ti/SiC interface. As a result, b of Ti/C-face 4H-SiC interface annealed at 400 oC is nearly equal to b of Ti/Si-face 4H-SiC interface annealed at 500 oC and the n-values of these SBDs are nearly equal to the ideal value (unity). Using that annealing condition, we fabricated 25mm2 junction barrier Schottky (JBS) diodes with Ti/SiC interface on Si-face and C-face 4H-SiC epitaxial substrate. b of Si-face and C-face JBS diodes are 1.26eV and 1.24eV, respectively. The leakage currents for both Si-face and C-face JBS diodes are less than 1mA/cm2. The current of 100A is obtained at the forward bias voltage of 1.95V and 2.16V for the Si-face JBS and the C-face JBS.
893
作者: Kenji Fukuda, Makoto Kato, Shinsuke Harada, Kazutoshi Kojima
摘要: SiC power MOSFETs are expected to be normally-off type fast switching devices. The on-resistance of SiC power MOSFETs is much higher than the value predicted from the physical properties of SiC. This is caused by the low channel mobility due to high interface state density (Dit). We have already reported that 4H-SiC MOSFETs on the C(0001 _ ) face had higher inversion-channel mobility. However, there is the SiO2/SiC interface roughness problem in SiC MOSFETs. There are many steps at the SiO2/SiC interface because a high off-angle is necessary for SiC epitaxial growth. These steps might make SiO2/SiC interfaces rough, which leads to reduction of channel mobility. In this work, we have investigated the effect of the SiO2/SiC interface roughness caused by the off-angle on the inversion channel mobility of 4H-SiC MOSFETs fabricated on the C(0001 _ ) face. The inversion-channel mobility of MOSFETs fabricated on the 4H-SiC C(0001 _ ) face substrate with the vicinal off-angle(0.8°) is higher than that of MOSFETs fabricated on the 4H-SiC C(0001 _ ) face substrate with the 8° off-angle. Reduction of the off-angle is very useful for improvement of channel mobility. A C(0001 _ ) epitaxial substrate with the vicinal off-angle would be suitable for SiC DMOSFETs.
1043
作者: Kenji Fukuda, Junji Senzaki, Kazutoshi Kojima, Takaya Suzuki
567
作者: Shinsuke Harada, Makoto Kato, Sachiko Ito, Kenji Suzuki, Takasumi Ohyanagi, Junji Senzaki, Kenji Fukuda, Hajime Okumura, Kazuo Arai
摘要: Reliability of the gate oxide is influenced by the device structure and the processes. In the SiC MOSFET, the surface morphology is degraded by the high temperature activation RTA, and the degradation is remarkable on the n+ source region. This study develops the method to suppress the degradation of the reliability of the gate oxide on the carbon face. By utilizing the carbon cap for the RTA and the high density O2 plasma etching to remove the carbon cap, the reliability is drastically improved both on the un-implanted and the implanted surfaces. Especially, the degradation of the reliability is perfectly suppressed on the un-implanted surface.
549
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